Semiconductor device

ABSTRACT

This invention provides a resin-sealed type semiconductor device capable of decreasing a generation of a simultaneous switching noise even in using a further highly integrated semiconductor LSI. More specifically, this invention provides a resin-type semiconductor device wherein a signal lead frame  105,  a power supply lead frame  104  and a grand lead frame  103  are accumulated via an electric insulating layer between layers. The power supply lead frame  104  and the grand lead frame  103  have a mesh shape with a plurality of openings in a plane electric conductor.

BACKGROUND OF THE INVENTION

[0001] The present invention relates to a semiconductor device and moreparticularly to a semiconductor device with staggered arrangement inthree lines on the peripheral part of the surface of a semiconductorpellet.

DESCRIPTION OF THE RELATED ART

[0002]FIGS. 8 and 9 show the configuration of an electrode withstaggered arrangement on the peripheral part of the surface of asemiconductor pellet in conventional art. FIG. 8 shows inside andoutside electrodes 402 in two lines with staggered arrangement on theperipheral part of a semiconductor pellet 401. As shown in FIG. 9, aninside-line electrode 403 has a square shape and an outside-lineelectrode 404 has a square shape or a rectangle shape in which the ratioof the sides is from 1 to 2.

[0003] However, the pad electrode arranged conventionally has followingproblems:

[0004] 1. Since the wiring connected to the outside-line electrode isarranged to pass between the adjacent inside-line electrodes and thewidth of wiring has to be narrower than the interval between theinside-line electrodes, the pad electrode cannot be used for a terminalfor a large amount of electric current and a grand terminal.

[0005] 2. In the wire bonding, the wiring mistake is caused in a fewcases by the wrong recognition of the adjacent pad electrode for thewire-bonding pad electrode.

[0006] 3. The neighboring wires contact each other in a few cases in thewire bonding by arranging the outside-line electrode near the center ofthe inside pad electrode.

SUMMERY OF THE INVENTION

[0007] An object of the present invention is to provide a novel andimproved semiconductor device capable of widening the width of wiringfor the outside electrode and embodying the wire bonding smoothly.

[0008] To solve the problem described above, the present representativeinvention provides:

[0009] A semiconductor device with staggered arrangement in three lineswith an inside-line electrode, a central-line electrode and anoutside-line electrode on the peripheral part of the surface of asemiconductor pellet, wherein the inside-line electrode configures ahexagonal electrode having a hypotenuse on the central-line electrodeside formed to cut vertically on the position at a distance of the sumof the minimum length (R) of the electrode necessary for wire-bondingand the minimum length (F) of the electrode protective film from thecenter of the electrode on the line connecting the center of a roughsquare shaped electrode with each side consisted of the sum of theminimum length (R) of the electrode necessary for wire-bonding and theminimum length (F) of the electrode protective film and the center ofthe adjacent central-line electrode, the central-line electrodeconfigures a hexagonal electrode having a hypotenuse on the inside-lineelectrode side formed to cut vertically on the position at a distance ofthe sum of the minimum length (R) of the electrode necessary forwire-bonding and the minimum length (F) of the electrode protective filmfrom the center of the electrode on the line connecting the center of arough square shaped electrode with each side consisted of the sum of theminimum length (R) of the electrode necessary for wire-bonding and theminimum length (F) of the electrode protective film and the center ofthe adjacent inside-line electrode; and a semiconductor device whereinthe maximum wiring width of the outside-line electrode wiredintermediately parallel to the hypotenuse of the central-line electrodeand the hypotenuse of the inside-line electrode is calculated with afollowing expression, considering the necessary minimum conductorinterval (I) between the central-line electrode and the inside-lineelectrode;

the maximum wiring width=(A ² +B ²)^(½)−(R+F+I)×2

[0010] Since the present invention can achieve the width of wiring ofthe outside-line electrode connected to the internal circuit, which iswider than the conventional width of wiring, the outside-line electrodecan be used as the one for a large amount of electric current, forexample, an electric power supply. Further, since the electrode of theinside-line electrode and the electrode of the outside-line electrodeare set apart each other, in recognizing the position of the electrodeat the process of wire bonding, the adjacent electrode is not wronglyrecognized.

BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above and other features of the invention and the concomitantadvantages will be better understood and appreciated by persons skilledin the field to which the invention pertains in view of the followingdescription given in conjunction with the accompanying drawings whichillustrate preferred embodiments. In the drawings:

[0012]FIG. 1 is a top plan view of a semiconductor device of firstembodiment;

[0013]FIG. 2 is a partially enlarged view of an electrode arranged inthe semiconductor device of the first embodiment;

[0014]FIG. 3 is a top plan view of a semiconductor device of secondembodiment;

[0015]FIG. 4 is a partially enlarged view of an electrode arranged inthe semiconductor device of the second embodiment;

[0016]FIG. 5 is a top plan view of a semiconductor device of thirdembodiment;

[0017]FIG. 6 is a partially enlarged view of an electrode arranged inthe semiconductor device of the third embodiment;

[0018]FIG. 7 is a sectional view of an electrode arranged in thesemiconductor device of the third embodiment;

[0019]FIG. 8 is a top plan view of a conventional semiconductor device;

[0020]FIG. 9 is a partially enlarged view of an electrode arranged inthe conventional semiconductor device.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] Hereinafter, the preferred embodiments of the present inventionwill be described in detail with reference to the accompanying drawings.Same reference numerals are attached to components having the samefunctions in following description and the accompanying drawings and adescription thereof is omitted.

[0022] (First Embodiment)

[0023] First, the first embodiment will be described in reference toFIGS. 1 and 2. It is to be noted that FIG. 1 is a top plan view of thesemiconductor device of this embodiment.

[0024] First, as shown in FIG. 1, an outside-line electrode 103, acentral-line electrode 105 and an inside-line electrode 106 of asemiconductor pellet 101 have a staggered arrangement in three lines onthe peripheral part 102 of a semiconductor pellet 101. The outside-lineelectrode is formed in a square shape or a rectangle shape in which theratio of the sides is from 1 to 2. The central-line electrode configuresa hexagonal electrode having a hypotenuse formed to cut two corners atpredetermined degrees on the inside-line electrode side of the roughsquare shaped electrode. The inside-line electrode configures ahexagonal electrode having a hypotenuse formed to cut the two corners atpredetermined degrees on the central-line electrode side of the roughsquare shaped electrode.

[0025] In addition, between the central-line electrode and theinside-line electrode, wiring for connecting an internal circuit 110 ofthe semiconductor pellet 101 to the outside-line electrode is formedparallel to the hypotenuses of the central-line electrode and theinside-line electrode.

[0026] Next, the explanations of the electrodes and the wiring arrangedin the semiconductor device of this embodiment will be provided inreference to FIG. 2. It is to be noted that FIG. 2 is a partiallyenlarged view of the electrode arranged in the semiconductor device ofthe present invention.

[0027] First, as shown in FIG. 2, a basic pattern of an inside-lineelectrode 108 is a rough square shaped electrode and the each side isformed parallel or vertically to a pellet side 117. The length of theeach side of the basic rough square shaped electrode is expressed by thesum of the minimum radius (R) 111 of the electrode necessary forwire-bonding and the minimum width (F) 112 of the electrode protectivefilm necessary for forming the electrode protective film from the center115 of the electrode, that is, a distance 113.

[0028] In this embodiment, the inside-line electrode 108 configures ahypotenuse formed to cut the rough square shaped electrode in adirection 119 which is perpendicular to a line segment G on the position(H) 118 at a distance of the sum of the minimum radius (R) 111 of theelectrode necessary for wire-bonding and the minimum width (F) 112 ofthe electrode protective film necessary for forming the electrodeprotective film, on the line segment (G) 150 connecting the center 145of the adjacent central-line electrode 107 and the center 115 of theinside-line electrode 108. In this embodiment, two hypotenuses areformed to cut two corners on the central-line electrode side of theinside-line electrode 108.

[0029] Since the inside-line electrode 108 has the hypotenuse on theposition at a distance between the center of the basic rough squareshaped electrode and each side of the electrode, the center 115 of theelectrode becomes the center of the inscribing circle in contact witheach side which is horizontal and vertical to the pellet side and withthe hypotenuses.

[0030] In this embodiment, the inside-line electrode 108 configures ahexagonal electrode having two hypotenuses formed to cut the two cornersfacing the central-line electrode of the basic rough square shapedelectrode at predetermined degrees and predetermined positions. Twosides 114 vertical to the pellet side 117 and two sides 116 horizontalto the pellet side 117 are the four sides of the basic rough squareshaped electrode, and hypotenuses 120 formed to face the central-sideelectrode are the remaining two sides.

[0031] It is to be noted that a protective film to protect the electrodeformed on the inside-line electrode 108 at the minimum width (F) 112parallel to each side 114, 116 and 120 of the electrode.

[0032] On the other hand, the central-line electrode 107 configures ahexagonal electrode having a hypotenuse formed to cut two corners atpredetermined degrees on the pellet side (the direction of theinside-line electrode) of the basic rough square shaped electrode. It isto be noted that the following description of the center of theelectrode represents the point located at the same distance from eachside of the basic rough square shaped electrode.

[0033] On the other hand, the basic pattern of the central-lineelectrode 107 is also a rough square shaped electrode, and the each sideis formed parallel or vertically to the pellet side. The length of theeach side of the rough square shaped electrode is expressed by the sumof the minimum radius (R) 141 of the electrode necessary forwire-bonding and the minimum width (F) 142 of the electrode protectivefilm necessary for forming the electrode protective film from the center145 of the electrode, that is, a distance 143.

[0034] In this embodiment, the central-line electrode 107 has ahypotenuse formed to cut the rough square shaped electrode in adirection 149 which is perpendicular to a line segment G, on theposition (H) 148 at a distance of the sum of the minimum radius (R) 141of the electrode necessary for wire-bonding and the minimum radius (F)142 of the electrode necessary for forming the electrode protectivefilm, on the line segment (G) 150 connecting the center 115 of theadjacent inside-line electrode 108 and the center 145 of thecentral-line electrode 107. In this embodiment, two hypotenuses areformed to cut two corners on the inside-line electrode side of thecentral-line electrode 107.

[0035] Since the central-line electrode 107 has the hypotenuse on theposition at a distance between the center of the basic rough squareshaped electrode and each side of the electrode, the center 145 of theelectrode becomes the center of the inscribing circle in contact witheach side which is horizontal and vertical to the pellet side and thehypotenuses.

[0036] In this embodiment, the central-line electrode 107 configures ahexagonal electrode having a hypotenuse formed to cut the two cornersfacing the inside-line electrode of the basic rough square shapedelectrode at predetermined degrees and predetermined positions. Twosides 144 vertical to the pellet side 117 and two sides 146 horizontalto the pellet side 117 are the four sides of the basic rough squareshaped electrode, and hypotenuses 158 formed to face the inside-sideelectrode are the remaining two sides.

[0037] It is to be noted that a protective film to protect the electrodeformed on the central-line electrode 107 at the minimum width (F) 142parallel to each side 144, 146 and 158 of the electrode.

[0038] In this embodiment, the central-line electrode 107 and theinside-line electrode 108 are the hexagonal electrodes on which thehypotenuses facing each other are formed.

[0039] In addition, the wiring, which connects the internal circuit tothe outside-line electrode, is formed between the central-line electrodeand the inside-line electrode. In this embodiment, the wiring for theoutside-line electrode is formed parallel to the hypotenuses between theinside-line electrode and the central-line electrode.

[0040] The maximum width 121 of the wiring for the outside-lineelectrode, which is formed intermediately parallel to the hypotenuses120 and 158 of the central-line electrode 107 and the inside-lineelectrode 108, is decided by the distance between the center of theadjacent central electrode 107 and the center of the inside-lineelectrode 108, which is calculated from the distance of verticaldirection (A) 122 between the centers of the electrodes and the distanceof horizontal direction (B) 123 between the centers of the electrodes,the minimum length (R) 111 and 141 of the electrode necessary forwire-bonding, the minimum length (F) 112 and 142 of the electrodeprotective film, and the minimum length (I) 129 of the electricconductor, and is showed by a following expression;

the maximum wiring width 121 between the hypotenuses=(A ² +B²)^(½)—(R+F+I)×2

[0041] Also, assuming that the thicknesses of the wirings are roughlyidentical each other, the maximum current of the outside-line electrode104 will be proportional to the width 121 of wiring of the hypotenuse.Consequently, the width between the hypotenuses is to be decided by thenecessary value of the current. The interval 122 and 123 between theadjacent central-line electrode 107 and the inside-line electrode 108,and the position and the form of the central-line electrode 107 and theinside-line electrode 108, is to be decided by calculating backward fromthe above-mentioned expression.

[0042] Since this embodiment can achieve the width of wiring of theoutside-line electrode connected to the internal circuit, which is widerthan the conventional width of wiring, the outside-line electrode can beused as the one for a large amount of electric current, for example, anelectric power supply. Further, since the electrode of the inside-lineelectrode and the electrode of the outside-line electrode are set aparteach other, in recognizing the position of the electrode at the processof wire bonding, the adjacent electrode is not wrongly recognized.

[0043] (Second Embodiment)

[0044] In the embodiment described above, a hexagonal electrode having ahypotenuse formed to cut the two corners facing each other of a basicrough square shaped electrode is introduced as a central electrode andan inside-line electrode. In this embodiment, an octagonal electrodehaving a hypotenuse formed to cut all of the four corners of a basicrough square shaped electrode is introduced as a central electrode andan inside-line electrode.

[0045] Next, the second embodiment will be described in reference toFIGS. 3 and 4. It is to be noted that FIG. 3 is a top plan view of thesemiconductor device of the present invention.

[0046] First, as shown in FIG. 3, an outside-line electrode 203, acentral-line electrode 205 and an inside-line electrode 206 of asemiconductor pellet 201 have a staggered arrangement in three lines onthe peripheral part 202 of a semiconductor pellet 201. The outside-lineelectrode is formed in a square shape or a rectangle shape in which theratio of the sides is from 1 to 2. The central-line electrode configuresan octagonal electrode having a hypotenuse formed to cut four corners ofthe rough square shaped electrode at predetermined degrees. Theinside-line electrode configures an octagonal electrode having ahypotenuse formed to cut the four corners of the rough square shapedelectrode at predetermined degrees.

[0047] In addition, between the central-line electrode and theinside-line electrode, wiring for connecting an internal circuit 210 ofthe semiconductor pellet 201 to the outside-line electrode is formedparallel to the hypotenuses of the central-line electrode and theinside-line electrode.

[0048] Next, the explanations of the electrodes and the wiring arrangedin the semiconductor device of this embodiment will be provided inreference to FIG. 4. It is to be noted that FIG. 4 is a partiallyenlarged view of the electrode arranged in the semiconductor device ofthe present invention.

[0049] First, as shown in FIG. 4, a basic pattern of an inside-lineelectrode 208 is a rough square shaped electrode and the each side isformed parallel or vertically to a pellet side 217. The length of theeach side of the basic rough square shaped electrode is expressed by thesum of the minimum radius (R) 211 of the electrode necessary forwire-bonding and the minimum width (F) 212 of the electrode protectivefilm necessary for forming the electrode protective film from the center215 of the electrode, that is, a distance 213.

[0050] In this embodiment, the inside-line electrode 208 has twohypotenuses formed to cut the rough square shaped electrode in adirection 219 which is perpendicular to a line segment G on the position(H) 218 at a distance of the sum of the minimum radius (R) 211 of theelectrode necessary for wire-bonding and the minimum width (F) 212 ofthe electrode protective film necessary for forming the electrodeprotective film, on the line segment (G) 250 connecting the center 245of the adjacent central-line electrode 207 and the center 215 of theinside-line electrode 208. In this embodiment, different from the onedescribed above, a hypotenuse on the pellet side cutting two corners inthe direction on a pellet 210 side of the inside-line electrode 208 isformed symmetrically and parallel to the hypotenuse on the central-lineelectrode side.

[0051] Since the inside-line electrode 207 has the hypotenuse on theposition at a distance between the center of the basic rough squareshaped electrode and each side of the electrode, the center 215 of theelectrode becomes the center of the inscribing circle in contact witheach side which is horizontal and vertical to the pellet side and withthe hypotenuses.

[0052] In this embodiment, the inside-line electrode 208 configures aoctagonal electrode having four hypotenuses formed to cut all the fourcorners of the basic rough square shaped electrode at predetermineddegrees and predetermined positions. Two sides 214 vertical to thepellet side 217 and two sides 216 horizontal to the pellet side 217 arethe four sides of the basic rough square shaped electrode, andhypotenuses 220 formed to cut all the four corners are the remainingfour sides.

[0053] It is to be noted that a protective film to protect the electrodeformed on the inside-line electrode 208 at the minimum width (F) 212parallel to each side of the electrode.

[0054] On the other hand, a basic pattern of a central-line electrode207 is a rough square shaped electrode, and the each side is formedparallel or vertically to a pellet side 217. The length of the each sideof the basic rough square shaped electrode is expressed by the sum ofthe minimum radius (R) 241 of the electrode necessary for wire-bondingand the minimum width (F) 242 of the electrode protective film necessaryfor forming the electrode protective film from the center 245 of theelectrode, that is, a distance 243.

[0055] In this embodiment, the central-line electrode 207 has twohypotenuses formed to cut the rough square shaped electrode in adirection 249 which is perpendicular to a line segment G, on theposition (H) 248 at a distance of the sum of the minimum radius (R) 241of the electrode necessary for wire-bonding and the minimum width (F)242 of the electrode protective film necessary for forming the electrodeprotective film, on the line segment (G) 250 connecting the center 215of the adjacent inside-line electrode 208 and the center 245 of thecentral-line electrode 207. In this embodiment, different from the onedescribed above, a hypotenuse on the outside-line electrode side cuttingtwo corners in the direction opposite to the pellet 210 side of theinside-line electrode 208, that is, the direction of the outside-lineelectrode 204, is formed symmetrically and parallel to the hypotenuse onthe inside-line electrode side.

[0056] Since the central-line electrode 208 has the hypotenuse on theposition at a distance between the center of the basic rough squareshaped electrode and each side of the electrode, the center 245 of theelectrode becomes the center of the inscribing circle in contact witheach side which is horizontal and vertical to the pellet side and thehypotenuses.

[0057] In this embodiment, the central-line electrode 207 configures aoctagonal electrode having four hypotenuses formed to cut all the fourcorners of the basic rough square shaped electrode at predetermineddegrees and predetermined positions. Two sides 244 vertical to thepellet side 217 and two sides 246 horizontal to the pellet side 217 arethe four sides of the basic rough square shaped electrode, andhypotenuses 258 formed to cut all the four corners are the remainingfour sides.

[0058] It is to be noted that a protective film to protect the electrodeformed on the central-line electrode 207 at the minimum width (F) 242parallel to each side of the electrode.

[0059] In this embodiment, the central-line electrode 207 and theinside-line electrode 208 are the hexagonal electrodes on which thehypotenuses facing each other are formed and on which the hypotenusescutting the two corners in the opposite direction are formed at the sametime.

[0060] In addition, the wiring, which connects the internal circuit tothe outside-line electrode, is formed between the central-line electrodeand the inside-line electrode. In this embodiment, the wiring for theoutside-line electrode is formed parallel to the hypotenuses between theinside-line electrode and the central-line electrode.

[0061] The maximum width of wiring 221 for the outside-line electrode,which is formed intermediately parallel to the hypotenuses 220 and 258of the central-line electrode 207 and the inside-line electrode 208, isdecided by the distance between the center of the adjacent centralelectrode 207 and the center of the inside-line electrode 208, which iscalculated from the distance of vertical direction (A) 222 between thecenters of the electrodes and the distance of horizontal direction (B)223 between the centers of the electrodes, the minimum length (R) 211and 241 of the electrode necessary for wire-bonding, the minimum length(F) 212 and 242 of the electrode protective film, and the minimum length(I) 229 of the electric conductor, and is showed by a followingexpression;

the maximum wiring width 221 between the hypotenuses=(A ² +B²)^(½)—(R+F+I)×2

[0062] Also, assuming that the thicknesses of the wirings are roughlyidentical each other, the maximum current of the outside-line electrode204 will be proportional to the width 221 of wiring of the hypotenuse.Consequently, the width between the hypotenuses is to be decided by thenecessary value of the current. The interval 223 between the adjacentcentral-line electrode 207 and the inside-line electrode 208, and theposition and form of the central-line electrode 207 and the inside-lineelectrode 208, is to be decided by calculating backward from theabove-mentioned expression.

[0063] Since this embodiment can achieve the width of wiring of theoutside-line electrode connected to the internal circuit, which is widerthan the conventional width of wiring, the wiring of the outside-lineelectrode can be used as the one for a large amount of electric current,for example, an electric power supply. Further, since the electrode ofthe inside-line electrode and the electrode of the outside-lineelectrode are set apart each other, in recognizing the position of theelectrode at the process of wire bonding, the adjacent electrode is notwrongly recognized. In addition, in this embodiment, since theinside-line electrode has a hypotenuse formed to cut two corners on theside of the pellet side, the freedom degree of wiring of theoutside-line electrode can be enhanced. Consequently, the short defectat the process of wire bonding is to be decreased gradually. Further,since the central-line electrode has a hypotenuse formed to cut twocorners on the side of the pellet side, the freedom degree of wiring canbe further enhanced.

[0064] (Third Embodiment)

[0065] In the embodiment described above, the explanation is providedwith regard to the configuration that a hexagonal or an octagonalelectrode is introduced as a central electrode and an inside-lineelectrode. In this embodiment, an electrode with a two-layer structureconfiguring an octagonal lower electrode on the lower layer and a squareupper electrode on the upper layer is introduced as a central electrodeand an inside-line electrode.

[0066] Next, the third embodiment will be described in reference to theFIGS. 5, 6 and 7. It is to be noted that FIG. 5 is a top plan view ofthe semiconductor device of the present invention.

[0067] First, as shown in FIG. 5, an outside-line electrode 303, acentral-line electrode 305 and an inside-line electrode 306 of asemiconductor pellet 301 have a staggered arrangement in three lines onthe peripheral part 302 of a semiconductor pellet 301. The outside-lineelectrode is formed in a square shape or a rectangle shape in which theratio of the sides is from 1 to 2. In this embodiment, it is to be notedthat the central-line electrode and the inside-line electrode configurea two-layer structure configuring an octagonal lower electrode on thelower layer and a square upper electrode on the upper layer.

[0068] In addition, between the lower electrode of the central-lineelectrode and the lower electrode of the inside-line electrode, wiringfor connecting an internal circuit 310 of the semiconductor pellet 301to the outside-line electrode is formed parallel to the hypotenuses ofthe central-line electrode and the inside-line electrode.

[0069] Next, the explanations of the electrodes and the wiring arrangedin the semiconductor device of this embodiment will be provided inreference to FIG. 6. It is to be noted that FIG. 6 is a partiallyenlarged view of the electrode arranged in the semiconductor device ofthe present invention.

[0070] In this embodiment, different from the one described above, thecentral-line electrode 307 has a two-layer structure consisting of thelower electrode configured of the octagonal electrode having ahypotenuse formed to cut all the four corners of the basic rough squareshaped electrode at predetermined degrees and predetermined positionsand the upper electrode configured of the rough square shaped electrodewith a predetermined size. In addition, the inside-line electrode 308has a two-layer structure consisting of the lower electrode configuredof the octagonal electrode having a hypotenuse formed to cut all thefour corners of the basic rough square shaped electrode at predetermineddegrees and predetermined positions and the upper electrode configuredof the rough square shaped electrode with a predetermined size.

[0071] As shown in FIG. 6, a basic pattern of the lower electrode 331 ofthe central-line electrode 307 is a rough square shaped electrode andthe each side is formed parallel or vertically to a pellet side 317. Thelength of the each side of the basic rough square shaped electrode isexpressed by the minimum radius (R) 341 of the electrode necessary forwire bonding from the center 345 of the electrode. It is to be notedthat the lower electrode 331 is covered with the insulating film so thatthe protective film is not formed thereon.

[0072] In this embodiment, the central-line electrode 307 has twohypotenuses formed to cut the rough square shaped electrode in adirection 349 which is perpendicular to a line segment G on the position(H) 348 at a distance of the minimum radius (R) 341 of the electrodenecessary for wire-bonding, on the line segment (G) 350 connecting thecenter 315 of the lower electrode 351 of the adjacent inside-lineelectrode 308 and the center 345 of the lower electrode 331 of thecentral-line electrode 307.

[0073] Since the lower electrode 331 of the central-line electrode 307has the hypotenuse on the position at a distance between the center ofthe basic rough square shaped electrode and each side of the electrode,the center 345 of the electrode becomes the center of the inscribingcircle in contact with each side which is horizontal and vertical to thepellet side and with the hypotenuses.

[0074] In this embodiment, the lower electrode 331 of the central-lineelectrode 307 configures a octagonal electrode having four hypotenusesformed to cut all the four corners of the basic rough square shapedelectrode at predetermined degrees and predetermined positions. Twosides 344 vertical to the pellet side 317 and two sides 346 horizontalto the pellet side 317 are the four sides of the basic rough squareshaped electrode, and hypotenuses 352 formed to cut all the four cornersare the remaining four sides.

[0075] In addition, in this embodiment, the octagonal lower electrode331 of the central-line electrode 307 is electrically connected to thesquare upper electrode 330 via a metal pillar 335 formed in a throughhole 334 in the insulating layer 333, as shown in FIG. 7. Further, onthe upper electrode 330, the protective film 325 to protect theelectrode is formed at the minimum width (F) 342 parallel to each sideof the electrode.

[0076] On the other hand, a basic pattern of the lower electrode 351 ofthe inside-line electrode 308 is a rough square shaped electrode, andthe each side is formed parallel or vertically to the pellet side 317.The length of the each side of the basic rough square shaped electrodeis expressed by the minimum radius (R) 311 of the electrode necessaryfor wire bonding from the center 315 of the electrode. It is to be notedthat the lower electrode 351 is covered with the insulating film so thatthe protective film is not formed thereon.

[0077] In this embodiment, the inside-line electrode 308 has twohypotenuses formed to cut the rough square shaped electrode in adirection 319 which is perpendicular to a line segment G on the position(H) 318 at a distance of the minimum radius (R) 311 of the electrodenecessary for wire-bonding, on the line segment (G) 350 connecting thecenter 345 of the lower electrode 331 of the adjacent central-lineelectrode 307 and the center 345 of the lower electrode 351 of theinside-line electrode 307.

[0078] Since the lower electrode 351 of the inside-line electrode 308has the hypotenuse on the position at a distance between the center ofthe basic rough square shaped electrode and each side of the electrode,the center 315 of the electrode becomes the center of the inscribingcircle in contact with each side which is horizontal and vertical to thepellet side and with the hypotenuses.

[0079] In this embodiment, the lower electrode 351 of the inside-lineelectrode 308 configures a octagonal electrode having four hypotenusesformed to cut all the four corners of the basic rough square shapedelectrode at predetermined degrees and predetermined positions. Twosides 314 vertical to the pellet side 317 and two sides 316 horizontalto the pellet side 317 are the four sides of the basic rough squareshaped electrode, and hypotenuses 320 formed to cut all the four cornersare the remaining four sides.

[0080] In addition, in this embodiment, the octagonal lower electrode351 of the inside-line electrode 308 is electrically connected to thesquare upper electrode 352 via a metal pillar formed in a through holein the insulating layer, similar to the case of the central-lineelectrode 307. Further, on the upper electrode 352, the protective filmto protect the electrode is formed at the minimum width (F) 312 parallelto each side of the electrode.

[0081] In this embodiment, the lower electrode 331 of the central-lineelectrode 307 and the lower electrode 331 of the inside-line electrode308 are the hexagonal electrodes on which the hypotenuses facing eachother are formed and on which the hypotenuses cutting the two corners inthe opposite direction are formed at the same time. Further, the upperelectrode, which is electrically connected to the lower electrode viathe insulating layer, has a rough square shape.

[0082] Between the lower electrode 331 of the central-line electrode 307and the lower electrode 351 of the inside-line electrode 308, which areconfigured as described above, a wiring 309 for connecting the internalcircuit 310 of the semiconductor pellet 301 to the outside-lineelectrode 308 is formed parallel to the hypotenuses of the central-lineelectrode 307 and the inside-line electrode 308.

[0083] The maximum width 321 of the wiring 309 for the outside-lineelectrode, which is formed intermediately parallel to the hypotenuses320 and 358 of the lower electrode 335 of the central-line electrode 307and the lower electrode 335 of the inside-line electrode 308, is decidedby the distance between the center of the lower electrode 331 of thecentral electrode 307 and the center of the lower electrode 351 of theinside-line electrode 308, which is calculated from the distance ofvertical direction (A) 322 between the centers of the electrodes and thedistance of horizontal direction (B) 323 between the centers of theelectrodes, the minimum length (R) 311 and 341 of the electrodenecessary for wire-bonding and the minimum length (I) 329 of theelectric conductor, and is showed by a following expression;

the maximum wiring width 321 between the hypotenuses=(A ² +B²)^(½)—(R+I)×2

[0084] In this embodiment, since the octagonal lower electrode iscovered with the insulating film and the protective film is not formed,the lower electrode can be formed smaller by the amount in which theprotective film is not formed. Consequently, the width of wiring can bewidened.

[0085] Also, assuming that the thicknesses of the wirings are roughlyidentical each other, the maximum current of the outside-line electrode304 will be proportional to the width 321 of wiring of the hypotenuse.Consequently, the width between the hypotenuses is to be decided by thenecessary value of the current. The interval 323 between the adjacentcentral-line electrode 307 and the inside-line electrode 308, and theposition and form of the central-line electrode 307 and the inside-lineelectrode 308, is to be decided by calculating backward from theabove-mentioned expression.

[0086] In this embodiment, since the protective film is not formed onthe lower electrode, the width between the lower electrodes can befurther widened by the amount in which the protective film is notformed. Consequently, the width of wiring of the outside-line electrodeconnected to the internal circuit can be widened. In addition, since theinside-line electrode has a hypotenuse formed to cut two corners on theside of the pellet side, the degree of freedom of wiring of theoutside-line electrode can be enhanced. Further, since the central-lineelectrode has a hypotenuse formed to cut two corners on the side of thepellet side, the degree of freedom of wiring can be further enhanced.

[0087] Since the central-line electrode and the inside-line electrodeare not arranged as linearly as they have been conventionally, the wrongrecognition of the adjacent electrode and the short defect with theadjacent wire are to be decreased gradually at the process ofwire-bonding. Further, since all the surfaces of the electrodes areformed in a square shape or a rectangle shape, the position of theelectrode can be smoothly recognized in a short time at the process ofwire bonding.

[0088] According to the third embodiment, since the insulating layer isformed on the parts of the lower electrodes of the central-lineelectrode and the inside-line electrode, the protective film need not beformed on the electrode. Consequently, the wiring is set between thelower electrodes of the central-line electrode and the inside-lineelectrode. The width of wiring of the outside-line electrode connectedto the internal circuit can be further widened. Consequently, theelectrode can be used as the one for a large amount of electric current,for example, an electric power supply. Further, since all the surfacesof the electrodes are formed in a square shape or a rectangle shape, theposition of the electrode can be smoothly recognized in a short time atthe process of wire bonding and the productivity of the semiconductordevice is increased.

[0089] Although the semiconductor device according to the preferredembodiment of the present invention has been described, the presentinvention is not restricted to such examples. It is evident to thoseskilled in the art that the present invention may be modified or changedwithin a technical philosophy thereof and it is understood thatnaturally these belong to the technical philosophy of the presentinvention.

[0090] In the third embodiment, for example, the explanation is providedwith regard to the configuration that the central-line electrode and theinside-line electrode have two-layer structures. However, if theuppermost layer of the electrode have a rough square shape, theembodiment can be achieved with a lower electrode having two layers ormore.

[0091] In addition, in this embodiment, the explanation is provided withregard to the example that the outside-line electrode is located in themiddle of the central-line electrode and the inside-line electrode whichare adjacent each otherand are arranged at regular intervals. However,the embodiment can be achieved even in the case that the central-lineelectrode and the inside-line electrode are not arranged at regularintervals.

[0092] Further, in the first and second embodiment, the explanation isprovided with regard to the configuration that the outside-lineelectrode is formed in a square shape or a rectangle shape. However, theembodiment can be achieved even in the case that the outside-lineelectrode is shaped identically to that of the central-line electrodeand the inside-line electrode.

[0093] Since the width of wiring of the outside-line electrode connectedto the internal circuit, which is wider than the conventional width ofwiring, the outside-line electrode can be used as the one for a largeamount of electric current, for example, an electric power supply.Further, since the electrode of the inside-line electrode and theelectrode of the outside-line electrode are set apart each other, inrecognizing the position of the electrode at the process of wirebonding, the adjacent electrode is not wrongly recognized.

What is claimed is:
 1. A semiconductor device with staggered arrangementin three lines with an inside-line electrode, a central-line electrodeand an outside-line electrode on the peripheral part of the surface of asemiconductor pellet, wherein; the inside-line electrode configures ahexagonal electrode having a hypotenuse on the central-line electrodeside formed to cut vertically on the position at a distance of the sumof the minimum length (R) of the electrode necessary for wire-bondingand the minimum length (F) of the electrode protective film from thecenter of the electrode on the line connecting the center of a roughsquare shaped electrode with each side consisted of the sum of theminimum length (R) of the electrode necessary for wire-bonding and theminimum length (F) of the electrode protective film and the center ofthe adjacent central-line electrode, the central-line electrodeconfigures a hexagonal electrode having a hypotenuse on the inside-lineelectrode side formed to cut vertically on the position at a distance ofthe sum of the minimum length (R) of the electrode necessary forwire-bonding and the minimum length (F) of the electrode protective filmfrom the center of the electrode on the line connecting the center of arough square shaped electrode with each side consisted of the sum of theminimum length (R) of the electrode necessary for wire-bonding and theminimum length (F) of the electrode protective film and the center ofthe adjacent inside-line electrode; and the maximum wiring width of theoutside-line electrode wired intermediately parallel to the hypotenuseof the central-line electrode and the hypotenuse of the inside-lineelectrode is calculated with a following expression, considering thenecessary minimum conductor interval (I) between the central-lineelectrode and the inside-line electrode; the maximum wiring width=(A ²+B ²)^(½)—(R+F+I)×2
 2. A semiconductor device according to claim 1wherein the outside-line electrode is formed in a square shape or arectangle shape in which the ratio of the sides is from 1 to
 2. 3. Asemiconductor device according to claim 1 wherein the outside-lineelectrode is formed in identical shape to the central-line electrode orthe inside-line electrode.
 4. A semiconductor device according to claim1 wherein the central-line electrode and the inside-line electrode arearranged at regular intervals.
 5. A semiconductor device according toclaim 1 wherein the central-line electrode and the inside-line electrodeare each arranged in arbitrary intervals.
 6. A semiconductor device withstaggered arrangement in three lines with an inside-line electrode, acentral-line electrode and an outside-line electrode on the peripheralpart of the surface of a semiconductor pellet, wherein; the inside-lineelectrode configures an octagonal electrode having a hypotenuse on thecentral-line electrode side formed to cut vertically on the position ata distance of the sum of the minimum length (R) of the electrodenecessary for wire-bonding and the minimum length (F) of the electrodeprotective film from the center of the electrode on the line connectingthe center of a rough square shaped electrode with each side consistedof the sum of the minimum length (R) of the electrode necessary forwire-bonding and the minimum length (F) of the electrode protective filmand the center of the adjacent central-line electrode, and having ahypotenuse on the pellet side formed in the symmetrical position withthe central-line electrode and parallel to the hypotenuse on thecentral-line electrode side in the pellet side direction, thecentral-line electrode configures an octagonal electrode having ahypotenuse on the inside-line electrode side formed to cut vertically onthe position at a distance of the sum of the minimum length (R) of theelectrode necessary for wire-bonding and the minimum length (F) of theelectrode protective film from the center of the electrode on the lineconnecting the center of a rough square shaped electrode with each sideconsisted of the sum of the minimum length (R) of the electrodenecessary for wire-bonding and the minimum length (F) of the electrodeprotective film and the center of the adjacent inside-line electrode,and having a hypotenuse on the outside-line electrode side formed in thesymmetrical position with the inside-line electrode and parallel to thehypotenuse on the inside-line electrode side in the opposite directionof the pellet side; and the maximum wiring width of the outside-lineelectrode wired intermediately parallel to the hypotenuse of thecentral-line electrode and the hypotenuse of the inside-line electrodeis calculated with a following expression, considering the necessaryminimum conductor interval (I) between the central-line electrode andthe inside-line electrode the maximum wiring width=(A ² +B ²)½—(R+F+I)×27. A semiconductor device according to claim 6 wherein the outside-lineelectrode is formed in a square shape or a rectangle shape in which theratio of the sides is from 1 to
 2. 8. A semiconductor device accordingto claim 6 wherein the outside-line electrode is formed in identicalshape to the central-line electrode or the inside-line electrode.
 9. Asemiconductor device according to claim 6 wherein the central-lineelectrode and the inside-line electrode are arranged at regularintervals.
 10. A semiconductor device according to claim 6 wherein thecentral-line electrode and the inside-line electrode are each arrangedin arbitrary intervals.
 11. A semiconductor device with staggeredarrangement in three lines with an inside-line electrode having a lowerelectrode and an upper electrode which are divided by an insulatingfilm, a central-line electrode having a lower electrode and an upperelectrode divided by an insulating film, and an outside-line electrodeon the peripheral part of the surface of a semiconductor pellet,wherein; the inside-line electrode configures a lower electrode in whicha hexagonal electrode is formed having a hypotenuse on the central-lineelectrode side formed to cut vertically on the position at a distance ofthe minimum length (R) of the electrode necessary for wire-bonding fromthe center of the electrode on the line connecting the center of a roughsquare shaped electrode with each side consisted of the minimum length(R) of the electrode necessary for wire-bonding and the center of theadjacent central-line electrode, and an upper electrode with roughsquare shaped connected to the lower electrode via a metal pillar formedin the insulating film, the central-line electrode configures a lowerelectrode in which a hexagonal electrode is formed having a hypotenuseon the inside-line electrode side formed to cut vertically on theposition at a distance of the minimum length (R) of the electrodenecessary for wire-bonding from the center of the electrode on the lineconnecting the center of a rough square shaped electrode with each sideconsisted of the minimum length (R) of the electrode necessary forwire-bonding and the center of the adjacent inside-line electrode, andan upper electrode with rough square shaped connected to the lowerelectrode via a metal pillar formed in the insulating film; and themaximum wiring width of the outside-line electrode wired intermediatelyparallel to the hypotenuse of the central-line electrode and thehypotenuse of the inside-line electrode is calculated with a followingexpression, considering the necessary minimum conductor interval (I )between the central-line electrode and the inside-line electrode; themaximum wiring width=(A ² +B ²)^(½)—(R+I)×2
 12. A semiconductor deviceaccording to claim 11 wherein the central-line electrode and theinside-line electrode configure an uppermost electrode with a roughsquare shape and a lower electrode having two layers or more.
 13. Asemiconductor device according to claim 11 wherein the central-lineelectrode and the inside-line electrode are arranged at regularintervals.
 14. A semiconductor device according to claim 11 wherein thecentral-line electrode and the inside-line electrode are each arrangedin arbitrary intervals.
 15. A semiconductor device with staggeredarrangement in three lines with an inside-line electrode having a lowerelectrode and an upper electrode divided by an insulating film, acentral-line electrode having a lower electrode and an upper electrodedivided by an insulating film, and an outside-line electrode on theperipheral part of the surface of a semiconductor pellet, wherein; theinside-line electrode configures a lower electrode consisted of aoctagonal electrode having a hypotenuse on the central-line electrodeside formed to cut vertically on the position at a distance of theminimum length (R) of the electrode necessary for wire-bonding from thecenter of the electrode on the line connecting the center of a roughsquare shaped electrode with each side consisted of the minimum length(R) of the electrode necessary for wire-bonding and the center of theadjacent central-line electrode, and having a hypotenuse on the pelletside formed in the symmetrical position with the central-line electrodeand parallel to the hypotenuse on the central-line electrode side on thepellet side direction, and an upper electrode with rough square shapedconnected to the lower electrode via a metal pillar formed in theinsulating film, the central-line electrode configures a lower electrodeconsisted of a octagonal electrode having a hypotenuse on theinside-line electrode side formed to cut vertically on the position at adistance of the minimum length (R) of the electrode necessary forwire-bonding from the center of the electrode on the line connecting thecenter of a rough square shaped electrode with each side consisted ofthe minimum length (R) of the electrode necessary for wire-bonding andthe center of the adjacent inside-line electrode, and having ahypotenuse on the pellet side formed in the symmetrical position withthe inside-line electrode and parallel to the hypotenuse on theinside-line electrode side on the opposite direction of the pellet side,and an upper electrode with rough square shaped connected to the lowerelectrode via a metal pillar formed in the insulating film; and themaximum wiring width of the outside-line electrode wired intermediatelyparallel to the hypotenuse of the lower electrode of the central-lineelectrode and the hypotenuse of the lower electrode of the inside-lineelectrode is calculated with a following expression, considering thenecessary minimum conductor interval (I) between the central-lineelectrode and the inside-line electrode; the maximum wiring width=(A ²+B ²)^(½)—(R+I)×2
 16. A semiconductor device according to claim 15wherein the central-line electrode and the inside-line electrodeconfigure an uppermost electrode with rough square shaped and a lowerelectrode having two layers or more.
 17. A semiconductor deviceaccording to claim 15 wherein the central-line electrode and theinside-line electrode are arranged at regular intervals.
 18. Asemiconductor device according to claim 15 wherein the central-lineelectrode and the inside-line electrode are each arranged in arbitraryintervals.